Lightmatter, the leader in photonic supercomputing announces Passage™ M1000, a groundbreaking 3D Photonic Superchip designed for next-generation XPUs and switches.

The Passage™ M1000 provides an unprecedented 114 Tbps of total optical bandwidth suited for the most intensive AI infrastructure applications. With an area exceeding 4,000 square millimeters, the M1000 reference platform serves as a multi-reticle active photonic interposer, facilitating the construction of the largest die complexes globally within a 3D package and allowing connectivity to numerous GPUs in one domain.

In current chip designs, the interconnections for processors, memory, and I/O chiplets are constrained by bandwidth due to electrical input/output (I/O) connections being confined to the peripheries of these chips.
The Passage M1000 addresses this restriction by enabling electro-optical I/O almost anywhere on its surface for the die complex positioned above. Widespread interposer connectivity is facilitated by a broad and adaptable waveguide system that transmits high-bandwidth WDM optical signals across the M1000.

Featuring a completely integrated fiber attachment that accommodates an exceptional 256 fibers, the M1000 provides significantly greater bandwidth in a more compact form factor than traditional Co-Packaged Optics (CPO) and comparable solutions.

Nick Harris, founder and CEO of Lightmatter says, “Passage M1000 is a breakthrough achievement in photonics and semiconductor packaging for AI infrastructure. We are delivering a cutting-edge photonics roadmap years ahead of industry projections. Shoreline is no longer a limitation for I/O. This is all made possible by our close co-engineering with leading foundry and assembly partners and our supply chain ecosystem.”

Dr. Thomas Caulfield, president and CEO of GF says, “GF has a long-standing strategic partnership with Lightmatter to commercialize its breakthrough photonics technology for AI data centers. The M1000 photonic interposer architecture, built on our GF Fotonix platform, sets the pace for photonics performance and will transform advanced AI chip design. Our advanced manufacturing capabilities and highly flexible, monolithic silicon photonics solution are instrumental in bringing this technology to market, and we look forward to continuing our close collaboration with Lightmatter.”

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“The insatiable demand for scale-up bandwidth is fueling interconnect innovation and momentum, with in-package optical integration at the forefront. Lightmatter’s unique 3D active photonic interposer presents a compelling advancement, with capabilities that surpass existing CPO solutions,” says Vlad Kozlov, founder and CEO, LightCounting.