Today, Tata Electronics will hold the Bhoomi Pooja ceremony for its first chip assembly and testing facility located on Jagi Road in Assam.

Assam Chief Minister Himanta Biswa Sarma, five Tata Group Directors, and Chairman of the Tata Group N Chandrasekaran would all be present at the Bhoomi Pooja ritual.

With the first phase projected to be operational by mid-2025, the plant, which is to be built on the former Hindustan Paper Corporation Ltd site, is expected to produce over 30,000 employment.

With ambitions grow the roadmap to advanced packaging technologies, the company will establish the facility with a focus on three major platform technologies: wire bond and integrated systems packaging (ISP), a unique offering.

It will be able to produce 48 million chips per day for use in consumer electronics, telecom, mobile phones, electric vehicles, and automobiles.

Before semiconductor wafers produced by semiconductor fabs are utilized in the intended product, they must first undergo assembly, packaging, and testing as a crucial step in the value chain.

The planned facility will meet the rising demand in major worldwide markets, including consumer electronics, industrial products, and artificial intelligence.

The initiative will give Northeast India's industrialization a huge boost. It is intended to be implemented under the Assam government's electronics strategy and the Center's semiconductor policy, which is guided by the India Semiconductor Mission.

For an estimated cost of Rs 1.26 lakh crore, the Union Cabinet had approved plans for three semiconductor facilities in February, two of which were in Gujarat and one in Assam.

At an estimated cost of Rs 91,000 crore, the proposals included the establishment of Taiwan's Powerchip Semiconductor Manufacturing Corp. (PSMC) and Tata Electronics' first semiconductor production factory, or fab, in Gujarat's Dholera.

Following the proposals' approval in February, Tata Electronics announced that its Assam OSAT facility would concentrate on Wire Bond, Flip Chip, and Integrated Systems Packaging (ISP), a unique offering. The company also stated that it intended to eventually expand the roadmap to include advanced packaging technologies.

According to the report, these technologies are vital for important Indian applications, including network infrastructure, communications, automotive (particularly electric vehicles), and others.