Tata Electronics signs a Memorandum of Understanding with semiconductor equipment and services supplier Tokyo Electron (TEL).

Through this MoU, Tata Electronics looks forward to accelerating semiconductor equipment infrastructure for both Tata's projects - India's first fab in Dholera, Gujarat, and its assembly and test facility in Jagiroad, Assam.

Through this partnership, the company said that Tokyo Electron will also focus on training Tata Electronics' workforce on the company's equipment and support ongoing improvement and R&D initiatives.

“TEL has a history of working closely with its customers, and its expertise in the semiconductor equipment space will help build a dynamic ecosystem to support the timely execution of bringing up our Fab and advanced packaging factories. We are excited about the customer centricity that TEL brings to this partnership,” says Dr Randhir Thakur, Managing Director & CEO, Tata Electronics.

Tata Electronics is building its first Indian plant in Gujarat with a total investment of Rs. 91,000 crores. The company will also invest Rs. 27,000 crore in a Greenfield facility in Assam to assemble and test semiconductor chips. Together, these facilities will produce semiconductor chips for applications in automotive, mobile devices, artificial intelligence (AI), and other key areas to serve customers worldwide.

As construction of these facilities progresses, the company said it is important to expand its partnerships across the entire semiconductor ecosystem, from process and design technology to equipment suppliers. With the announcement of its partnership with Tokyo Electron, TEL is pleased to announce that it has entered into a partnership with Tokyo Electron, a manufacturer of semiconductor production equipment.

Toshiki Kawai, President ＆ CEO of Tokyo Electron says, “This strategic collaboration spans both front-end fabrication and back-end packaging technologies, highlighting our commitment to delivering exceptional support and value to Tata Electronics. By leveraging our collective strengths, we aim to accelerate development and drive innovation across multiple technology nodes. Together, we are poised to set new benchmarks in the industry, fostering a robust and dynamic semiconductor landscape that will benefit all stakeholders.”