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RRP Semiconductor Enters Fabless Semiconductor Market
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towards the independent design and development of semiconductor solutions.
The company has obtained all intellectual property (IP) for ASIC (Application Specific Integrated Circuit) designs from its European technological partners. RRP Semiconductor is now in a position to provide end-to-end semiconductor solutions because of the support of its consortium and group firms, which includes fab prototype and outsourced semiconductor assembly and test (OSAT) packaging capabilities. Through its new ASIC design capabilities, the company will be able to produce a wide range of automotive chips and components at scale. These parts are now mostly imported, which offers a big commercial opportunity. Within two years of deployment, market estimates indicate a growth from $25 million to over $100 million.
ASICs are custom-designed integrated circuits for specific applications, such as voice recorders or video codecs. These chips, which can include microprocessors, ROM, RAM, EEPROM, and flash memory, are essential in producing System-on-Chip(SoC) solutions. With the ASIC market expected to exceed $30 billion by 2031 and grow at a CAGR of 7.10 percent from 2031 to 2034, RRP Semiconductor is well-positioned for rapid growth.